Motherboard Cooling Analysis

Motherboard Cooling Analysis

Title:

Description:

SERVICES PROVIDED

Flow CFD Modeling

Multiphase Flow Analysis

Transient Thermo Modeling and Analysis

Temperature and Airflow Distribution

Wrapping Analysis of Motherboard

Parametric Modeling and Simulation

Electrothermal Analysis

Recommendation on Flow Methodology and Improvements

Cost-effective Design Recommendation

THE NEED

To perform Computational Fluid Dynamics (CFD) analysis on a multicore, dual processor, high thread count motherboard to find its ideal operating temperature and optimize the cooling method to prevent any thermal dissipation problem and thermal failure of components.

SOLUTION PROVIDED

The architecture and the location of heat zones were accurately modeled using 3D design software and exported to analysis software, where the housing, cooling zones, and flow temperature is modeled. The outcome of this analysis is to find the right cooling method for optimal operation. Parametric design and analysis performed to check the results when air and water cooling are deployed in addition to the location of the cooling zone in the housing.

AS A RESULT,

It is noted that the higher operating temperature is caused due to stagnant hot air near the heat zones, and near the densely packed components. Quadrant team has optimally sized the components so that even under high thermal load conditions, the max temperature doesn’t reach the threshold limit.

QUADRANT

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+1 (407) 601-7128

+1 (800) 558-4064 – Toll-Free

info@quadranteng.com

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